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See Technical Specifications

THGBMJG6C1LBAU7 +BOM

AEC-Q100 153-Pin VFBGA Tray

Manufacturer:

Kioxia America, Inc.
Mfr.Part #:

THGBMJG6C1LBAU7
Datasheet:

THGBMJG6C1LBAU7 Datasheet (PDF)
Programmabe:

Verified
Memory Type:

Non-Volatile
Memory Format:

FLASH
Technology:

FLASH - NAND
EDA/CAD Models:

Request Free CAD Models for THGBMJG6C1LBAU7

THGBMJG6C1LBAU7 General Description

Compact and versatile, the THGBMJG6C1LBAU7 chip comes in a 96-ball BGA package, making it suitable for a wide range of embedded applications. Its low voltage range of 2.7-3.6V ensures energy efficiency, while a power consumption of 2.2W during active use and 160mW in standby mode strikes a balance between performance and power-saving. Whether you're looking to boost the storage capacity of your smartphone or enhance the speed of your SSD, this NAND flash memory chip is a versatile solution that delivers on all fronts

Specifications

Programmabe	Verified	Memory Type	Non-Volatile
Memory Format	FLASH	Technology	FLASH - NAND
Memory Size	64Gbit	Memory Organization	8G x 8
Memory Interface	eMMC	Clock Frequency	-
Write Cycle Time - Word, Page	-	Access Time	-
Voltage - Supply	-	Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount