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See Technical Specifications

THGBMFG7C1LBAIL +BOM

Memory IC 153-FBGA (11.5x13)

Manufacturer:

Kioxia America, Inc.
Mfr.Part #:

THGBMFG7C1LBAIL
Datasheet:

THGBMFG7C1LBAIL Datasheet (PDF)
Part Life Cycle Code:

Obsolete
HTS Code:

8542.31.00.01
JESD-30 Code:

R-PBGA-B153
Number Of Terminals:

153
EDA/CAD Models:

Request Free CAD Models for THGBMFG7C1LBAIL

THGBMFG7C1LBAIL General Description

The THGBMFG7C1LBAIL NAND flash memory module from Toshiba boasts cutting-edge 64-layer 3D NAND flash memory technology, elevating its storage capabilities and performance to new heights. With a compact BGA package measuring 15mm x 20mm x 1.3mm, this module is perfect for modern compact devices like smartphones, tablets, and portable media players. Its generous 128GB storage capacity provides ample room for multimedia content such as music, videos, and photos, while delivering lightning-fast data transfer speeds for seamless user experience

Key Features

Data integrity and security
High-speed data transfer rates
Sustained high-performance operation

Application

Smartwatch
Automobiles
Portable devices
Smart appliances

Specifications

Source Content uid	THGBMFG7C1LBAIL	Part Life Cycle Code	Obsolete
Reach Compliance Code		HTS Code	8542.31.00.01
JESD-30 Code	R-PBGA-B153	Number of Terminals	153
Operating Temperature-Max	85 °C	Operating Temperature-Min	-25 °C
Supply Voltage-Max	3.6 V	Supply Voltage-Min	2.7 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Form	BALL
Terminal Position	BOTTOM	uPs/uCs/Peripheral ICs Type	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE