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THGBMJG8C4LBAU8 +BOM

eMMC ROHS FBGA-153 THGBMJG8C4LBAU8

Manufacturer:

Kioxia America, Inc.
Mfr.Part #:

THGBMJG8C4LBAU8
Datasheet:

THGBMJG8C4LBAU8 Datasheet (PDF)
Part Life Cycle Code:

Active
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
JESD-30 Code:

R-PBGA-B153
EDA/CAD Models:

Request Free CAD Models for THGBMJG8C4LBAU8

THGBMJG8C4LBAU8 General Description

Whether you're a professional looking for a high-performance storage solution or a casual user in need of reliable data storage, the THGBMJG8C4LBAU8 SSD is an excellent choice. Its impressive sequential and random read/write speeds, combined with Toshiba's innovative features, guarantee a seamless computing experience with minimal downtime and maximum productivity

Specifications

Part Life Cycle Code	Active	Reach Compliance Code
ECCN Code	EAR99	HTS Code	8542.32.00.51
JESD-30 Code	R-PBGA-B153	Length	13 mm
Memory Density	274877906944 bit	Memory IC Type	Embedded MMC
Memory Width	8	Number of Functions	1
Number of Terminals	153	Number of Words	34359738368 words
Number of Words Code	32000000000	Operating Mode	ASYNCHRONOUS
Operating Temperature-Max	105 °C	Operating Temperature-Min	-40 °C
Organization	32GX8	Seated Height-Max	0.8 mm
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3.3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	BALL	Terminal Pitch	0.5 mm
Terminal Position	BOTTOM	Type	NAND TYPE
Width	11 mm