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See Technical Specifications

K4B2G1646F-BCK0 +BOM

Compact -Pin FBGA package for space-sensitive design

K4B2G1646F-BCK0 is a specific type of electronic component, known as a Dynamic Random Access Memory (DRAM) module.

Memory capacity: 2 Gigabits (Gb)
Organization: 256 Megabytes (MB) x 16 bits x 8 banks
Speed: 1600 Megahertz (MHz) with a data rate of 800 Megabits per second (Mbps) per pin
Operating voltage: 35 volts

Personal computers (PCs), laptops, and servers: It is commonly used as the main memory in these devices to store and quickly access data during program execution.
Mobile devices: It can serve as the primary memory in smartphones, tablets, and other portable gadgets, allowing for efficient data processing and multitasking.
Consumer electronics: It is suitable for gaming consoles, set-top boxes, and digital TVs to enhance system performance and responsiveness.
Industrial applications: DRAM modules like K4B2G1646F-BCK0 are used in various industrial control systems, automated machinery, and robotics to support real-time data processing.

feature-organization	128Mx16	feature-process-technology
feature-minimum-operating-supply-voltage-v	1.425	feature-maximum-access-time-ns	0.225
feature-maximum-operating-supply-voltage-v	1.575	feature-maximum-operating-current-ma	118
feature-packaging		feature-rad-hard
feature-pin-count	96	feature-cecc-qualified
feature-esd-protection		feature-military	No
feature-aec-qualified	No	feature-aec-qualified-number
feature-auto-motive	No	feature-p-pap	No
feature-eccn-code	EAR99	feature-svhc
feature-svhc-exceeds-threshold	No