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CMOS DDR DRAM 16MX16 0.7ns PDSO66
TSSOP66Manufacturer:
Mfr.Part #:
K4H561638H-UCB3
Datasheet:
Pbfree Code:
Yes
Part Life Cycle Code:
Obsolete
ECCN Code:
EAR99
HTS Code:
8542.32.00.24
EDA/CAD Models:
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This SDRAM module, K4H561638H-UCB3 from Samsung, boasts an impressive capacity of 512 megabytes (MB) and a unique organization of 4 banks of 4 megabit (Mbit) x 16 bits. Operating at a voltage of 2.5 volts (V), it supports lightning-fast data transfer rates up to 166 megatransfers per second (MT/s). This high-performance module leverages its DDR interface to transmit data on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate compared to traditional SDRAM
Pbfree Code | Yes | Part Life Cycle Code | Obsolete |
ECCN Code | EAR99 | HTS Code | 8542.32.00.24 |
Access Time-Max | 0.7 ns | Clock Frequency-Max (fCLK) | 166 MHz |
I/O Type | COMMON | Interleaved Burst Length | 2,4,8 |
JESD-30 Code | R-PDSO-G66 | JESD-609 Code | e6 |
Memory Density | 268435456 bit | Memory IC Type | DDR1 DRAM |
Memory Width | 16 | Moisture Sensitivity Level | 3 |
Number of Terminals | 66 | Number of Words | 16777216 words |
Number of Words Code | 16000000 | Operating Temperature-Max | 70 °C |
Organization | 16MX16 | Output Characteristics | 3-STATE |
Peak Reflow Temperature (Cel) | 260 | Power Supplies | 2.3 V |
Qualification Status | Not Qualified | Refresh Cycles | 8192 |
Sequential Burst Length | 2,4,8 | Standby Current-Max | 0.003 A |
Supply Current-Max | 0.33 mA | Supply Voltage-Nom (Vsup) | 2.3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | COMMERCIAL | Terminal Finish | TIN BISMUTH |
Terminal Form | GULL WING | Terminal Pitch | 0.635 mm |
Terminal Position | DUAL |
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