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K4H561638H-UCB3 +BOM

CMOS DDR DRAM 16MX16 0.7ns PDSO66

K4H561638H-UCB3 General Description

This SDRAM module, K4H561638H-UCB3 from Samsung, boasts an impressive capacity of 512 megabytes (MB) and a unique organization of 4 banks of 4 megabit (Mbit) x 16 bits. Operating at a voltage of 2.5 volts (V), it supports lightning-fast data transfer rates up to 166 megatransfers per second (MT/s). This high-performance module leverages its DDR interface to transmit data on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate compared to traditional SDRAM

Samsung Inventory

Key Features

  • High-performance computing capability
  • Efficient data processing speeds
  • Robust system compatibility
Samsung Original Stock

Application

  • Mobile phones
  • Tablets
  • Internet of Things (IoT) devices
  • Wearable technology
  • Smart home devices
  • Automotive electronics
  • Digital cameras
  • Industrial applications
  • Medical devices
  • Military and aerospace systems
Samsung Inventory

Specifications

Pbfree Code Yes Part Life Cycle Code Obsolete
ECCN Code EAR99 HTS Code 8542.32.00.24
Access Time-Max 0.7 ns Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G66 JESD-609 Code e6
Memory Density 268435456 bit Memory IC Type DDR1 DRAM
Memory Width 16 Moisture Sensitivity Level 3
Number of Terminals 66 Number of Words 16777216 words
Number of Words Code 16000000 Operating Temperature-Max 70 °C
Organization 16MX16 Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 260 Power Supplies 2.3 V
Qualification Status Not Qualified Refresh Cycles 8192
Sequential Burst Length 2,4,8 Standby Current-Max 0.003 A
Supply Current-Max 0.33 mA Supply Voltage-Nom (Vsup) 2.3 V
Surface Mount YES Technology CMOS
Temperature Grade COMMERCIAL Terminal Finish TIN BISMUTH
Terminal Form GULL WING Terminal Pitch 0.635 mm
Terminal Position DUAL

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