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See Technical Specifications

H5PS5162FFR-20L +BOM

DDR DRAM, 32MX16, 0.35ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84

VDD = 1.8 +/- 0.1V

VDDQ = 1.8 +/- 0.1V

All inputs and outputs are compatible with SSTL_18 interface

8 banks

Fully differential clock inputs (CK, /CK) operation

Double data rate interface

Source synchronous-data transaction aligned to bidirectional data strobe (DQS, DQS)

Differential Data Strobe (DQS, DQS)

Data outputs on DQS, DQS edges when read (edged DQ)

Data inputs on DQS centers when write (centered DQ)

On chip DLL align DQ, DQS and DQS transition with CK transition

DM mask write data-in at the both rising and falling edges of the data strobe

All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock

Programmable CAS latency 3, 4, 5 and 6 supported

Programmable additive latency 0, 1, 2, 3, 4 and 5 supported

Programmable burst length 4/8 with both nibble sequential and interleave mode

Internal eight bank operations with single pulsed RAS

Auto refresh and self refresh supported

tRAS lockout supported

8K refresh cycles /64ms

JEDEC standard 84ball FBGA(x16)

Full strength driver option controlled by EMR

On Die Termination supported

Off Chip Driver Impedance Adjustment supported

Self-Refresh High Temperature Entry

Average Refresh Cycle (Tcase 0 oC~ 95 oC)

- 7.8 s at 0oC ~ 85 oC

- 3.9 s at 85oC ~ 95 oC

Commercial Temperature( 0oC ~ 85 oC)

Industrial Temperature( -40oC ~ 95 oC)

Part Life Cycle Code	Obsolete	Pin Count	84
Reach Compliance Code		ECCN Code	EAR99
HTS Code	8542.32.00.28	Access Mode	FOUR BANK PAGE BURST
Access Time-Max	0.35 ns	Additional Feature	AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)	500 MHz	I/O Type	COMMON
Interleaved Burst Length	4,8	JESD-30 Code	R-PBGA-B208
JESD-609 Code	e1	Length	13 mm
Memory Density	536870912 bit	Memory IC Type	DDR2 DRAM
Memory Width	16	Number of Functions	1
Number of Ports	1	Number of Terminals	84
Number of Words	33554432 words	Number of Words Code	32000000
Operating Mode	SYNCHRONOUS	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	32MX16
Output Characteristics	3-STATE	Peak Reflow Temperature (Cel)	260
Power Supplies	1.8 V	Qualification Status	Not Qualified
Refresh Cycles	8192	Seated Height-Max	1.2 mm
Self Refresh	YES	Sequential Burst Length	4,8
Standby Current-Max	0.01 A	Supply Current-Max	0.3 mA
Supply Voltage-Max (Vsup)	1.9 V	Supply Voltage-Min (Vsup)	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Terminal Form	BALL
Terminal Pitch	0.8 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	20	Width	8 mm