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H5TQ2G63DFR-PBC +BOM

This product is a DDR DRAM with a capacity of 128 megabits organized in a 16-bit configuration, featuring a fast speed of 0.225 nanoseconds

Key Features

  • VDD=VDDQ=1.5V +/- 0.075V
  • Fully differential clock inputs (CK, CK) operation
  • Differential Data Strobe (DQS, DQS)
  • On chip DLL align DQ, DQS and DQS transition with CK 
  • transition
  • DM masks write data-in at the both rising and falling 
  • edges of the data strobe
  • All addresses and control inputs except data, 
  • data strobes and data masks latched on the 
  • rising edges of the clock
  • Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13
  • and 14 supported
  • Programmable additive latency 0, CL-1, and CL-2 
  • supported
  • Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10
  • Programmable burst length 4/8 with both nibble 
  • sequential and interleave mode
  • BL switch on the fly
  • 8banks
  • Average Refresh Cycle (Tcase of0 oC~ 95oC)
  • - 7.8 µs at 0oC ~ 85 oC
  • - 3.9 µs at 85oC ~ 95 oC
  • JEDEC standard 78ball FBGA(x4/x8)
  • Driver strength selected by EMRS
  • Dynamic On Die Termination supported
  • Asynchronous RESET pin supported
  • ZQ calibration supported
  • TDQS (Termination Data Strobe) supported (x8 only)
  • Write Levelization supported
  • 8 bit pre-fetch
  • This product in compliance with the RoHS directive.

Specifications

Part Life Cycle Code Obsolete Pin Count 96
Reach Compliance Code ECCN Code EAR99
HTS Code 8542.32.00.36 Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.225 ns Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz I/O Type COMMON
Interleaved Burst Length 4,8 JESD-30 Code R-PBGA-B96
Length 13 mm Memory Density 2147483648 bit
Memory IC Type DDR3 DRAM Memory Width 16
Number of Functions 1 Number of Ports 1
Number of Terminals 96 Number of Words 134217728 words
Number of Words Code 128000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 128MX16 Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) NOT SPECIFIED Qualification Status Not Qualified
Refresh Cycles 8192 Seated Height-Max 1.2 mm
Self Refresh YES Sequential Burst Length 4,8
Standby Current-Max 0.012 A Supply Current-Max 0.235 mA
Supply Voltage-Max (Vsup) 1.575 V Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm

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