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See Technical Specifications

H5PS5162FFR-25C +BOM

DDR DRAM with a capacity of 32MX16 and a latency of 0.5ns

VDD = 1.8 +/- 0.1V
VDDQ = 1.8 +/- 0.1V
All inputs and outputs are compatible with SSTL_18 interface
8 banks
Fully differential clock inputs (CK, /CK) operation
Double data rate interface
Source synchronous-data transaction aligned to bidirectional data strobe (DQS, DQS)
Differential Data Strobe (DQS, DQS)
Data outputs on DQS, DQS edges when read (edged DQ)
Data inputs on DQS centers when write (centered DQ)
On chip DLL align DQ, DQS and DQS transition with CK transition
DM mask write data-in at the both rising and falling edges of the data strobe
All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
Programmable CAS latency 3, 4, 5 and 6 supported
Programmable additive latency 0, 1, 2, 3, 4 and 5 supported
Programmable burst length 4/8 with both nibble sequential and interleave mode
Internal eight bank operations with single pulsed RAS
Auto refresh and self refresh supported
tRAS lockout supported
8K refresh cycles /64ms
JEDEC standard 84ball FBGA(x16)
Full strength driver option controlled by EMR
On Die Termination supported
Off Chip Driver Impedance Adjustment supported
Self-Refresh High Temperature Entry
Average Refresh Cycle (Tcase 0 oC~ 95 oC)
- 7.8 µs at 0oC ~ 85 oC
- 3.9 µs at 85oC ~ 95 oC
Commercial Temperature( 0oC ~ 85 oC)
Industrial Temperature( -40oC ~ 95 oC)

Part Life Cycle Code	Obsolete	Pin Count	84
Reach Compliance Code		ECCN Code	EAR99
HTS Code	8542.32.00.28	Access Mode	FOUR BANK PAGE BURST
Access Time-Max	0.5 ns	Additional Feature	AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)	400 MHz	I/O Type	COMMON
Interleaved Burst Length	4,8	JESD-30 Code	R-PBGA-B208
JESD-609 Code	e1	Length	13 mm
Memory Density	536870912 bit	Memory IC Type	DDR2 DRAM
Memory Width	16	Number of Functions	1
Number of Ports	1	Number of Terminals	84
Number of Words	33554432 words	Number of Words Code	32000000
Operating Mode	SYNCHRONOUS	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	32MX16
Output Characteristics	3-STATE	Peak Reflow Temperature (Cel)	260
Qualification Status	Not Qualified	Refresh Cycles	8192
Seated Height-Max	1.2 mm	Self Refresh	YES
Sequential Burst Length	4,8	Standby Current-Max	0.008 A
Supply Current-Max	0.28 mA	Supply Voltage-Max (Vsup)	1.9 V
Supply Voltage-Min (Vsup)	1.7 V	Supply Voltage-Nom (Vsup)	1.8 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form	BALL	Terminal Pitch	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	20
Width	8 mm