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NAND02GW3B2DZA6E +BOM

NAND Flash FBGA-63(9.5x12) RoHS Certified

NAND02GW3B2DZA6E General Description

The NAND02GW3B2DZA6E from Micron Technology is a cutting-edge NAND flash memory chip designed for high-performance electronic devices. With a storage capacity of 2GB and a 3.3V power supply requirement, this chip offers a perfect balance between storage size and power efficiency. Its MLC NAND flash memory technology enables it to store large amounts of data in a compact form factor, making it a versatile choice for a wide range of applications

Key Features

  • HIGH DENSITY NAND FLASH MEMORIES
  • – Up to 1 Gbit memory array
  • – Up to 32 Mbit spare area
  • – Cost effective solutions for mass storage applications
  • NAND INTERFACE
  • – x8 or x16 bus width
  • – Multiplexed Address/ Data
  • – Pinout compatibility for all densities
  • SUPPLY VOLTAGE
  • – 1.8V device: VDD = 1.7 to 1.95V
  • – 3.0V device: VDD = 2.7 to 3.6V
  • PAGE SIZE
  • – x8 device: (512 + 16 spare) Bytes
  • – x16 device: (256 + 8 spare) Words
  • BLOCK SIZE
  • – x8 device: (16K + 512 spare) Bytes
  • – x16 device: (8K + 256 spare) Words
  • PAGE READ / PROGRAM
  • – Random access: 12µs (max)
  • – Sequential access: 50ns (min)
  • – Page program time: 200µs (typ)
  • COPY BACK PROGRAM MODE
  • – Fast page copy without external buffering
  • FAST BLOCK ERASE
  • – Block erase time: 2ms (Typ)
  • STATUS REGISTER
  • ELECTRONIC SIGNATURE
  • CHIP ENABLE ‘DON’T CARE’ OPTION
  • – Simple interface with microcontroller
  • SERIAL NUMBER OPTION
  • HARDWARE DATA PROTECTION
  • – Program/Erase locked during Power transitions
  • DATA INTEGRITY
  • – 100,000 Program/Erase cycles
  • – 10 years Data Retention
  • RoHS COMPLIANCE
  • – Lead-Free Components are Compliant with the RoHS Directive
  • DEVELOPMENT TOOLS
  • – Error Correction Code software and hardware models
  • – Bad Blocks Management and Wear Leveling algorithms
  • – File System OS Native reference software
  • – Hardware simulation models

Specifications

Programmabe Not Verified Memory Type Non-Volatile
Memory Format FLASH Technology FLASH - NAND
Memory Size 2Gbit Memory Organization 256M x 8
Memory Interface Parallel Clock Frequency -
Write Cycle Time - Word, Page 25ns Access Time 25 ns
Voltage - Supply 2.7V ~ 3.6V Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

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