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NAND512W3A2SNXE +BOM

High-quality SLC NAND Flash memory for reliable data storage

NAND512W3A2SNXE General Description

When it comes to high-speed, high-capacity storage, the NAND512W3A2SNXE chip stands out as a top choice for those seeking cutting-edge technology and performance. Its use of 3D NAND technology allows for a compact yet powerful design, while its advanced error correction and wear-leveling algorithms offer peace of mind when it comes to data integrity and longevity

Key Features

  • High density NAND Flash memories
  • – 512 Mbit memory array
  • – Cost effective solutions for mass storage applications
  • NAND interface
  • – x 8 or x 16 bus width
  • – Multiplexed Address/ Data
  • Supply voltage: 1.8 V, 3.0 V
  • Page size
  • – x 8 device: (512 + 16 spare) bytes
  • – x 16 device: (256 + 8 spare) words
  • Block size
  • – x 8 device: (16 K + 512 spare) bytes
  • – x 16 device: (8 K + 256 spare) words
  • Page Read/Program
  • – Random access: 12 µs (3 V)/15 µs (1.8 V) (max)
  • – Sequential access: 30 ns (3 V)/50 ns (1.8 V) (min)
  • – Page Program time: 200 µs (typ)
  • Copy Back Program mode
  • Fast Block Erase: 2 ms (typ)
  • Status Register
  • Electronic signature
  • Chip Enable ‘don’t care’
  • Serial Number option
  • Hardware Data Protection
  • – Program/Erase locked during Power transitions
  • Data integrity
  • – 100,000 Program/Erase cycles (with ECC)
  • – 10 years Data Retention
  • ECOPACK® packages
  • Development tools
  • – Error Correction Code models
  • – Bad Blocks Management and Wear Leveling algorithms
  • – Hardware simulation models

Specifications

Programmabe Not Verified Memory Type Non-Volatile
Memory Format FLASH Technology FLASH - NAND
Memory Size 512Mbit Memory Organization 64M x 8
Memory Interface Parallel Clock Frequency -
Write Cycle Time - Word, Page 50ns Access Time 50 ns
Voltage - Supply 2.7V ~ 3.6V Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

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